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SI/PI PCB Design Considerations for Thermal


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1/25/18 1:00 pm to 1/25/18 2:00 pm EST

Event Description

Keysight Webinar Series 2018


Typically signal integrity (SI) and power integrity (PI) engineers set or assume the temperature for analysis at room temperature. However, the temperature may be higher than that, depending on the DUT location on PCB. What thermal effects for SI and PI do we anticipate if the PCB temperature is high?
In this webcast, we will review the thermal effects on your PCB designs and demonstrate the performance changes due to the temperature change based on a practical case study.

Who should view this webcast:

Signal Integrity & Power Integrity engineers and PCB designers wanting to gain a greater knowledge of thermal issues in PCBs.

Presenter Bio:

Hee-Soo Lee holds a BSEE degree from the Hankuk Aviation University, Korea. He has more than 20 years of design and simulation experience in the area of RF and Microwave designs, and is currently the Applications Specialist for 3D EM solutions at Keysight EEsof EDA.