Signal Integrity Journal Webinar Series
Title: How to Develop High-Quality Test Fixtures for De-embedding S-Parameters
Date: March 31, 2022
Time: 8am PT / 11am ET
Presented by: James Drewniak, President, Clear Signal Solutions, Inc.
Q&A Presented by: Bichen Chen, PSI Hardware Engineer (SIPI), Meta
Extracting high-quality S-parameters for a DUT from measurements requires de-embedding them from a total structure, including the test fixture lead-ins. These lead-ins can include probes or connectors, some length of non-coaxial transmission-line (e.g., stripline or microstrip on a PCB), as well as via transitions. A common de-embedding approach for DUTs on PCBs, packages, and cabling uses a 2X Thru together with the total structure in order to extract the DUT S-parameters. However, for successful de-embedding in many high-speed and high-frequency applications, it is necessary to perform a 3D full-wave electromagnetic (EM) simulation for developing a high-quality test fixture. This webinar explores the features that comprise good lead-in test fixturing from which DUT S-parameters can be extracted. It also explains examples of EM simulation for developing test fixtures. The webinar also touches on how to make quality S-parameter measurements with a VNA and provides comparison results. Examples for de-embedding to 50 GHz will be detailed.
James Drewniak received B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign. He was a Curator’s Professor of Electrical and Computer Engineering with the Electromagnetic Compatibility Laboratory in the Electrical Engineering Department at the Missouri University of Science and Technology. His research and teaching interests focused on electromagnetic compatibility in high-speed digital and mixed-signal designs, signal and power integrity, and electronic packaging. After 28 years with the university, he retired and founded Clear Signal Solutions, a company providing measurement and characterization solutions for signal and power integrity applications. He is a Fellow of the IEEE, and recipient of the 2013 Richard R. Stoddart Award, the IEEE Electromagnetic Compatibility Society’s highest award for technical achievement. He has taught short courses widely for industry on signal and power integrity, and EMI.
Q&A Presenter Bio:
Bichen Chen received his Ph.D. degree in Electrical Engineering from the Missouri University of Science and Technology (formerly University of Missouri-Rolla) in 2019. Currently, he is a Hardware (SIPI) Engineer in the Infrastructure Group of Meta (Previously as Facebook). His research interests include signal and power integrity in high-speed digital systems, digital system processing and, equalizations in the SerDes devices.
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