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The columns contained in this SI/PI/EMC & EMI Fundamentals section come from members of the Signal Integrity Journal community who are experts in their field and have a commitment to providing training and education in SI/PI/EMI issues for other engineers.
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Millimeter Waves Technologies and Challenges for EMC & Wireless

The extension of operating frequencies in the mmWave region and beyond is the story of wireless development for the next thirty years. Understanding the resulting challenges and improving the state-of-the-art is a key driver for the EMC and wireless Industries. This article takes a look at some of the fundamentals of mmWave, including signal propagation, available spectrum, and challenges and issues facing EMC.


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Miniature Bulkhead EMI Filters for Aerospace Applications

Component manufacturers continue to develop increasingly miniaturized bulkhead filter capacitors that also offer increased current capacity, voltage, and operating temperature ranges. This post looks at the details of this miniaturization in order to help aerospace systems designers satisfy stringent size and weight constraints and further improve system performance.


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Coming Up: Easier Signal Integrity Simulation Setup with IBIS 7.0

There was a time when the signal integrity of connections between digital ICs could be nearly ensured by following one simple rule: don’t connect more than some maximum number of input pins to any single output pin. Often the fanout limit would be around 7. No models, no simulations. Everything we needed was in the thick books of vendor datasheets that filled our shelves, the tree-killing viral precursor to AOL installation CDs. Ah, those were the days!


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PCI Express Gen5 is Coming: What You Need to Know for Tx Measurements

While we all love increased network speed, there is an implied assumption that the backbone speeds of the internet will keep up with this rising demand placed upon it by millions of new 5G devices. PCIe 5.0 (or Gen5) represents the technology that is needed by the computer, data center, and ultimately the 5G wireless industry to enable the next generation of mobile and desktop applications. So, what is PCI Express 5.0 and how does it compare to PCI 4.0? Read on to find out.


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Far-field Emissions from PCB Cavities

In high-speed circuit designs, power integrity (PI) and electromagnetic interference (EMI) are connected together. When the edge of the cavity created by power (PWR) and ground (GND) planes in PCBs radiates, the peak frequencies in the emissions are the same as the peak frequencies in the cavity self-impedance.


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