The Quest for Smoother Copper May Have Reached Its Limit

By Eric Bogatin

Copper loss is one ingredient in interconnect loss. Surface texture or roughness has long been recognized as adding an excess loss over smooth copper. With the SI-VSP (very smooth profile) copper foils recently introduced by Mitsui Mining & Smelting Co. Ltd. (Mitsui Kinzoku), we may have reached the limits. Read on to discover more.

Testing Automotive Electronics: Rohde & Schwarz Exhibits Fast, Strong and Compact Test Solutions at EMV 2020

At EMV 2020 in Cologne, Germany, Rohde & Schwarz will present EMC test solutions for users in the automotive industry: the fastest CISPR-25 certification, a strong and compact BCI test system, and R&S AdVISE version 5, which keeps a close eye even on vibrating display elements during EMS tests.

PicoScope 6000E Series: A Smarter Scope for Faster Debug

Pico Technology Ltd announces the PicoScope 6000E Series FlexRes® oscilloscopes, featuring 8 channels with 500 MHz bandwidth, 16 digital channels, and resolution of 8, 10 or 12 bits. The products work with PicoScope 6 application software, which takes advantage of the latest PC performance and display capabilities, showing clean, crisp waveforms on screens of any size and resolution.

Advertisement

Impedance Measurements for Power Delivery Networks

Sponsored By Rohde & Schwarz

Impedance measurements with vector network analyzers require maximum precision. The R&S®ZNL from Rohde & Schwarz is able to characterize a broad range of impedances with the lowest uncertainty among its competitors in the same class. Learn more about our product and the solution. Downlaod the white paper.

Test Vehicles for Benchmarking 3D Full-Wave Solver Performance: Available On-Demand

This webcast presented by Al Neves, is best for high-speed designers who need to design test fixtures as well as backplane designers working on 10-32Gb/s NRZ to 112G PAM-4 can benefit from adopting high-confidence design methodologies when using 3D full-wave solvers. This webinar aims to help you build better test, characterization, and backplane systems, by improving understanding and avoiding the common pitfalls. View the on-demand presentation today.

Visit our archived webinars page for educational resources on various design and measurement subjects and view at your convenience.
Browse webinars here.

EDI CON CHINA Rescheduled to September 2020

Following the developments of the coronavirus (COVID-19) outbreak closely and its impact on colleagues and customers in China, Horizon House announced today that EDI CON CHINA, May 12-13, 2020 in Beijing, China has been rescheduled for September 27 and 28, 2020 at the Chinese National Convention Center (CNCC), Beijing, China. More details here.